268-5401-52-1102JH 3M Interconnect Solutions


lcc.pdf Виробник: 3M Interconnect Solutions
Conn LCC Socket SKT 68 POS 2.54mm Solder ST Thru-Hole Box
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Технічний опис 268-5401-52-1102JH 3M Interconnect Solutions

Description: CONN SOCKET CLCC 68POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: CLCC, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 68 (4 x 17), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Obsolete.

Інші пропозиції 268-5401-52-1102JH

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268-5401-52-1102JH 268-5401-52-1102JH Виробник : 3M 3mtm-textooltm-oem-lcc-production-socket.pdf Description: CONN SOCKET CLCC 68POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: CLCC
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 68 (4 x 17)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
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268-5401-52-1102JH 268-5401-52-1102JH Виробник : 3M Electronic Solutions Division ts0359-65756.pdf IC & Component Sockets TYPE"A" LCC W/FINNED HEAT SINK
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