Технічний опис 28-350002-11-RC Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.3, Material: FR4 Epoxy Glass, Package Accepted: SOIC, Proto Board Type: DIP to DIP, Board Thickness: 0.062" (1.57mm), Pitch: 0.050" (1.27mm), Number of Positions: 28, Board Material: FR4 Epoxy Glass, Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Pitch - Mating: 0.050" (1.27mm), Termination: Solder, Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing, Convert From (Adapter End): SOIC, Mounting Type: Through Hole, Number of Pins: 28, Packaging: Tube.
Інші пропозиції 28-350002-11-RC
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
28-350002-11-RC | Aries Electronics |
 Description: SOCKET ADAPTER SOIC TO 28DIP 0.3Material: FR4 Epoxy Glass Package Accepted: SOIC Proto Board Type: DIP to DIP Board Thickness: 0.062" (1.57mm) Pitch: 0.050" (1.27mm) Number of Positions: 28 Board Material: FR4 Epoxy Glass Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Pitch - Mating: 0.050" (1.27mm) Termination: Solder Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert From (Adapter End): SOIC Mounting Type: Through Hole Number of Pins: 28 Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 154 шт В кошику од. на суму грн. |
 |
28-350002-11-RC | ARIES |
Description: ARIES - 28-350002-11-RC - IC- & Baustein-Sockel, 28 Kontakt(e), Adapter, 2.54 mm, 350000-11-RC, 3.81 mm, Messing Kontaktüberzug: Vergoldete Kontakte Steckverbindertyp: Adapter Rastermaß: 2.54 Anzahl der Kontakte: 28 Kontaktmaterial: Messing Reihenabstand: 3.81 Produktpalette: 350000-11-RC SVHC: No SVHC (15-Jan-2018) |
товару немає в наявності |
В кошику од. на суму грн. |
| 28-350002-11-RC |
|
Виробник: Aries Electronics
Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Material: FR4 Epoxy Glass
Package Accepted: SOIC
Proto Board Type: DIP to DIP
Board Thickness: 0.062" (1.57mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 28
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert From (Adapter End): SOIC
Mounting Type: Through Hole
Number of Pins: 28
Packaging: Tube
Description: SOCKET ADAPTER SOIC TO 28DIP 0.3
Material: FR4 Epoxy Glass
Package Accepted: SOIC
Proto Board Type: DIP to DIP
Board Thickness: 0.062" (1.57mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 28
Board Material: FR4 Epoxy Glass
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Pitch - Mating: 0.050" (1.27mm)
Termination: Solder
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert From (Adapter End): SOIC
Mounting Type: Through Hole
Number of Pins: 28
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 154 шт
В кошику
од. на суму грн.
| 28-350002-11-RC |
|
Виробник: ARIES
Description: ARIES - 28-350002-11-RC - IC- & Baustein-Sockel, 28 Kontakt(e), Adapter, 2.54 mm, 350000-11-RC, 3.81 mm, Messing
Kontaktüberzug: Vergoldete Kontakte
Steckverbindertyp: Adapter
Rastermaß: 2.54
Anzahl der Kontakte: 28
Kontaktmaterial: Messing
Reihenabstand: 3.81
Produktpalette: 350000-11-RC
SVHC: No SVHC (15-Jan-2018)
Description: ARIES - 28-350002-11-RC - IC- & Baustein-Sockel, 28 Kontakt(e), Adapter, 2.54 mm, 350000-11-RC, 3.81 mm, Messing
Kontaktüberzug: Vergoldete Kontakte
Steckverbindertyp: Adapter
Rastermaß: 2.54
Anzahl der Kontakte: 28
Kontaktmaterial: Messing
Reihenabstand: 3.81
Produktpalette: 350000-11-RC
SVHC: No SVHC (15-Jan-2018)
товару немає в наявності
В кошику
од. на суму грн.