28-3552-16 Aries Electronics
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Boron
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Nickel Boron
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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Технічний опис 28-3552-16 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 50.0µin (1.27µm), Contact Finish - Post: Nickel Boron, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Finish - Mating: Nickel Boron, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 28 (2 x 14), Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Інші пропозиції 28-3552-16
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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28-3552-16 | Виробник : Aries Electronics |
IC & Component Sockets DIP TEST SCKT NICKEL 28 PINS |
товару немає в наявності |