| Кількість | Ціна |
|---|---|
| 1+ | 1400.53 грн |
| 9+ | 1197.04 грн |
| 27+ | 986.56 грн |
| 54+ | 971.93 грн |
| 108+ | 858.36 грн |
| 252+ | 800.54 грн |
| 504+ | 783.12 грн |
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Технічний опис 28-6552-10* Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN, Packaging: Bulk, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 28 (2 x 14), Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame.
Інші пропозиції 28-6552-10*
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 28-6552-10 | Виробник : Aries Electronics |
 Description: CONN IC DIP SOCKET ZIF 28POS TINPackaging: Bulk Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame |
товару немає в наявності |