28-6574-11 Aries Electronics
| Кількість | Ціна |
|---|---|
| 1+ | 2631.18 грн |
| 11+ | 2202.59 грн |
| 22+ | 1752.26 грн |
| 55+ | 1719.52 грн |
| 110+ | 1603.16 грн |
| 253+ | 1580.87 грн |
| 506+ | 1577.38 грн |
Відгуки про товар
Написати відгук
Технічний опис 28-6574-11 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN, Number of Positions or Pins (Grid): 28 (2 x 14), Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Termination: Solder.
Інші пропозиції 28-6574-11
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
28-6574-11 | Виробник : Aries Electronics |
 Description: CONN IC DIP SOCKET ZIF 28POS TINNumber of Positions or Pins (Grid): 28 (2 x 14) Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk Part Status: Active Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder |
товару немає в наявності |