Результат пошуку "286556" : 21

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SN74HC139PWT SN74HC139PWT Texas Instruments scls108e.pdf Description: IC DECODER/DEMUX 1X2:4 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Discontinued at Digi-Key
на замовлення 9750 шт:
термін постачання 21-31 дні (днів)
628+33.79 грн
Мінімальне замовлення: 628
SN74HC139PWT SN74HC139PWT Texas Instruments scls108e.pdf Description: IC DECODER/DEMUX 1X2:4 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Discontinued at Digi-Key
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
250+39.19 грн
500+ 35.91 грн
750+ 34.99 грн
Мінімальне замовлення: 250
SN74HC139PWT SN74HC139PWT Texas Instruments scls108e.pdf Description: IC DECODER/DEMUX 1X2:4 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Discontinued at Digi-Key
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
4+79.16 грн
10+ 52.91 грн
25+ 47.16 грн
100+ 38.28 грн
Мінімальне замовлення: 4
28-6556-10 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
28-6556-10 28-6556-10 Aries Electronics 10003-universal-test-socket-receptacle-337545.pdf IC & Component Sockets 28 SCKT RECEPT TIN SOLDER TAIL
товар відсутній
28-6556-11 28-6556-11 Aries Electronics 10003-universal-test-socket-receptacle-337545.pdf IC & Component Sockets 29 SCKT RECEPT GOLD SOLDER TAIL
товар відсутній
28-6556-11 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
28-6556-20 28-6556-20 Aries Electronics 10003-universal-test-socket-receptacle-337545.pdf IC & Component Sockets 28 SCKT RECEPT TIN WIRE WRAP
товар відсутній
28-6556-20 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
28-6556-21 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
28-6556-21 28-6556-21 Aries Electronics 10003-universal-test-socket-receptacle-337545.pdf IC & Component Sockets 28 SCKT RECEPT GOLD WIRE WRAP
товар відсутній
28-6556-30 28-6556-30 Aries Electronics 10003-universal-test-socket-receptacle-337545.pdf IC & Component Sockets UNIV TEST SOCKET
товар відсутній
28-6556-30 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
28-6556-31 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
28-6556-31 28-6556-31 Aries Electronics 10003-universal-test-socket-receptacle-337545.pdf IC & Component Sockets 28 SCKT RECEPT GOLD WIRE WRAP
товар відсутній
28-6556-40 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder Cup
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
28-6556-40 28-6556-40 Aries Electronics 10003-universal-test-socket-receptacle-337545.pdf IC & Component Sockets 28 SCKT RECEPT TIN SOLDER CUP
товар відсутній
28-6556-41 Aries Electronics 10003-universal-test-socket-receptacle.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder Cup
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
28-6556-41 28-6556-41 Aries Electronics 10003-universal-test-socket-receptacle-337545.pdf IC & Component Sockets 28 SCKT RECEPT GOLD SOLDER CUP
товар відсутній
28655 3M Description: HOOKIT ROLOC DISC
Packaging: Bulk
товар відсутній
8-655621-8 TE Application Tooling Description: CRIMPER INSULATION
Packaging: Bulk
товар відсутній
SN74HC139PWT scls108e.pdf
SN74HC139PWT
Виробник: Texas Instruments
Description: IC DECODER/DEMUX 1X2:4 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Discontinued at Digi-Key
на замовлення 9750 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
628+33.79 грн
Мінімальне замовлення: 628
SN74HC139PWT scls108e.pdf
SN74HC139PWT
Виробник: Texas Instruments
Description: IC DECODER/DEMUX 1X2:4 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Discontinued at Digi-Key
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
250+39.19 грн
500+ 35.91 грн
750+ 34.99 грн
Мінімальне замовлення: 250
SN74HC139PWT scls108e.pdf
SN74HC139PWT
Виробник: Texas Instruments
Description: IC DECODER/DEMUX 1X2:4 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Discontinued at Digi-Key
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
4+79.16 грн
10+ 52.91 грн
25+ 47.16 грн
100+ 38.28 грн
Мінімальне замовлення: 4
28-6556-10 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
28-6556-10 10003-universal-test-socket-receptacle-337545.pdf
28-6556-10
Виробник: Aries Electronics
IC & Component Sockets 28 SCKT RECEPT TIN SOLDER TAIL
товар відсутній
28-6556-11 10003-universal-test-socket-receptacle-337545.pdf
28-6556-11
Виробник: Aries Electronics
IC & Component Sockets 29 SCKT RECEPT GOLD SOLDER TAIL
товар відсутній
28-6556-11 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
28-6556-20 10003-universal-test-socket-receptacle-337545.pdf
28-6556-20
Виробник: Aries Electronics
IC & Component Sockets 28 SCKT RECEPT TIN WIRE WRAP
товар відсутній
28-6556-20 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
28-6556-21 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
28-6556-21 10003-universal-test-socket-receptacle-337545.pdf
28-6556-21
Виробник: Aries Electronics
IC & Component Sockets 28 SCKT RECEPT GOLD WIRE WRAP
товар відсутній
28-6556-30 10003-universal-test-socket-receptacle-337545.pdf
28-6556-30
Виробник: Aries Electronics
IC & Component Sockets UNIV TEST SOCKET
товар відсутній
28-6556-30 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
28-6556-31 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
28-6556-31 10003-universal-test-socket-receptacle-337545.pdf
28-6556-31
Виробник: Aries Electronics
IC & Component Sockets 28 SCKT RECEPT GOLD WIRE WRAP
товар відсутній
28-6556-40 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder Cup
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
28-6556-40 10003-universal-test-socket-receptacle-337545.pdf
28-6556-40
Виробник: Aries Electronics
IC & Component Sockets 28 SCKT RECEPT TIN SOLDER CUP
товар відсутній
28-6556-41 10003-universal-test-socket-receptacle.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder Cup
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
28-6556-41 10003-universal-test-socket-receptacle-337545.pdf
28-6556-41
Виробник: Aries Electronics
IC & Component Sockets 28 SCKT RECEPT GOLD SOLDER CUP
товар відсутній
28655
Виробник: 3M
Description: HOOKIT ROLOC DISC
Packaging: Bulk
товар відсутній
8-655621-8
Виробник: TE Application Tooling
Description: CRIMPER INSULATION
Packaging: Bulk
товар відсутній