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289-PRS17001-12

289-PRS17001-12 Aries Electronics

10004-pga-zif-test-and-burn-in-socket.pdf Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 59 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+9971.44 грн
10+8162.24 грн
25+7651.76 грн
50+6838.60 грн
В кошику  од. на суму  грн.
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Технічний опис 289-PRS17001-12 Aries Electronics

Description: CONN SOCKET PGA ZIF GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, ZIF (ZIP), Operating Temperature: -65°C ~ 125°C, Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper, Part Status: Active.