Продукція > PRECI-DIP > 299-83-608-10-002101
299-83-608-10-002101

299-83-608-10-002101 Preci-Dip


Default.aspx?c=14&i=1192&p=271&pdf=1&dsku=299-PP-XXX-XX-00X101 Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
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Технічний опис 299-83-608-10-002101 Preci-Dip

Description: CONN IC DIP SOCKET 8POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Right Angle, Horizontal, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass.

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299-83-608-10-002101 299-83-608-10-002101 Виробник : Preci-dip preci-dip_pdsas00759-1-1747011.pdf Board to Board & Mezzanine Connectors
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