| Кількість | Ціна |
|---|---|
| 1+ | 716.08 грн |
| 10+ | 671.32 грн |
| 23+ | 495.78 грн |
| 115+ | 383.35 грн |
| 506+ | 382.66 грн |
| 1012+ | 380.56 грн |
Відгуки про товар
Написати відгук
Технічний опис 299-87-618-10-002101 Preci-dip
Description: CONN IC DIP SOCKET 18POS GOLD, Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: FLASH, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 18 (2 x 9), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Right Angle, Horizontal, Features: Closed Frame, Packaging: Tube, Contact Material - Post: Brass, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm).
Інші пропозиції 299-87-618-10-002101
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
|
299-87-618-10-002101 | Preci-Dip |
Description: CONN IC DIP SOCKET 18POS GOLDContact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 18 (2 x 9) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Packaging: Tube Contact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) |
товару немає в наявності |
Мінімальне замовлення: 644 шт В кошику од. на суму грн. |
| 299-87-618-10-002101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Horizontal
Features: Closed Frame
Packaging: Tube
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Description: CONN IC DIP SOCKET 18POS GOLD
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Horizontal
Features: Closed Frame
Packaging: Tube
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
товару немає в наявності
Мінімальне замовлення: 644 шт
В кошику
од. на суму грн.




