30-6503-31 Aries Electronics
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Contact Finish - Mating: Gold
Type: DIP, 0.6" (15.24mm) Row Spacing
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Pitch - Mating: 0.100" (2.54mm)
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 30 (2 x 15)
Operating Temperature: -55°C ~ 125°C
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
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Технічний опис 30-6503-31 Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD, Contact Finish - Mating: Gold, Type: DIP, 0.6" (15.24mm) Row Spacing, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Pitch - Mating: 0.100" (2.54mm), Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Wire Wrap, Number of Positions or Pins (Grid): 30 (2 x 15), Operating Temperature: -55°C ~ 125°C, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold.
Інші пропозиції 30-6503-31
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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30-6503-31 | Виробник : Aries Electronics |
IC & Component Sockets LO-PRO FILE COLLET WIRE WRAP 30 PINS |
товару немає в наявності |