32-6572-11 Aries Electronics
| Кількість | Ціна |
|---|---|
| 1+ | 2922.99 грн |
| 10+ | 2448.57 грн |
| 20+ | 1999.60 грн |
| 50+ | 1932.71 грн |
| 100+ | 1813.57 грн |
| 200+ | 1761.32 грн |
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Технічний опис 32-6572-11 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 32 (2 x 16), Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Інші пропозиції 32-6572-11
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 32-6572-11 | Виробник : Aries Electronics |
 Description: CONN IC DIP SOCKET ZIF 32POS TINContact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 32 (2 x 16) Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
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