335824B00032G Boyd Laconia, LLC
Виробник: Boyd Laconia, LLC
Description: PGA,335824B00032G
Material Finish: Black Anodized
Fin Height: 0.370" (9.40mm)
Thermal Resistance @ Natural: 29.40°C/W
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Attachment Method: Thermal Tape, Adhesive (Included)
Package Cooled: BGA, FPGA
Width: 1.180" (29.97mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 1.180" (29.97mm)
Material: Aluminum
Packaging: Bulk
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Технічний опис 335824B00032G Boyd Laconia, LLC
Description: PGA,335824B00032G, Material Finish: Black Anodized, Fin Height: 0.370" (9.40mm), Thermal Resistance @ Natural: 29.40°C/W, Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 1.5W @ 50°C, Attachment Method: Thermal Tape, Adhesive (Included), Package Cooled: BGA, FPGA, Width: 1.180" (29.97mm), Type: Top Mount, Shape: Square, Pin Fins, Length: 1.180" (29.97mm), Material: Aluminum, Packaging: Bulk.
Інші пропозиції 335824B00032G
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 335824B00032G | Виробник : Aavid |
 Heat Sinks Heat Sink for Metal/Ceramic BGA, Black, 30x30x9.40mm, IC=31x31, Tape #32 |
товару немає в наявності |