335824B00034G Boyd Laconia, LLC

Description: HEATSINK BGA W/ADHESIVE TAPE, Packaging: Bulk, Material: Aluminum, Length: 1.180" (29.97mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.180" (29.97mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 2.0W @ 60°C, Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM, Thermal Resistance @ Natural: 29.40°C/W, Fin Height: 0.370" (9.40mm), Material Finish: Black Anodized, Part Status: Active.