Технічний опис 35028K2JT TE Connectivity / Holsworthy
Description: RES 3502 8K2 5%, Resistance: 8.2 kOhms, Height - Seated (Max): 0.047" (1.20mm), Supplier Device Package: 2010, Number of Terminations: 2, Operating Temperature: -55°C ~ 155°C, Composition: Thick Film, Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm), Temperature Coefficient: ±100ppm/°C, Package / Case: 2010 (5025 Metric), Tolerance: ±5%, Power (Watts): 2W, Packaging: Tape & Reel (TR).
Інші пропозиції 35028K2JT
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
|
35028K2JT | TE Connectivity Passive Product |
Description: RES 3502 8K2 5%Resistance: 8.2 kOhms Height - Seated (Max): 0.047" (1.20mm) Supplier Device Package: 2010 Number of Terminations: 2 Operating Temperature: -55°C ~ 155°C Composition: Thick Film Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Temperature Coefficient: ±100ppm/°C Package / Case: 2010 (5025 Metric) Tolerance: ±5% Power (Watts): 2W Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. |
| 35028K2JT |
![]() |
Виробник: TE Connectivity Passive Product
Description: RES 3502 8K2 5%
Resistance: 8.2 kOhms
Height - Seated (Max): 0.047" (1.20mm)
Supplier Device Package: 2010
Number of Terminations: 2
Operating Temperature: -55°C ~ 155°C
Composition: Thick Film
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Temperature Coefficient: ±100ppm/°C
Package / Case: 2010 (5025 Metric)
Tolerance: ±5%
Power (Watts): 2W
Packaging: Tape & Reel (TR)
Description: RES 3502 8K2 5%
Resistance: 8.2 kOhms
Height - Seated (Max): 0.047" (1.20mm)
Supplier Device Package: 2010
Number of Terminations: 2
Operating Temperature: -55°C ~ 155°C
Composition: Thick Film
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Temperature Coefficient: ±100ppm/°C
Package / Case: 2010 (5025 Metric)
Tolerance: ±5%
Power (Watts): 2W
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 4000 шт
В кошику
од. на суму грн.




