375124B60024G Aavid
Виробник: Aavid
Heat Sinks Heat Sink with BGA Solder Anchor, 40x40x25mm, Black, 2 Anchors, IC Pkg=42 x 40
| Кількість | Ціна |
|---|---|
| 2+ | 315.76 грн |
| 504+ | 306.39 грн |
| 1008+ | 256.56 грн |
| 2520+ | 244.57 грн |
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Технічний опис 375124B60024G Aavid
Description: HEATSINK BGA W/O SOLDER ANCHORS, Material Finish: Black Anodized, Fin Height: 0.984" (25.00mm), Thermal Resistance @ Natural: 10.30°C/W, Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 8.0W @ 80°C, Attachment Method: Solder Anchor, Package Cooled: BGA, Width: 1.575" (40.01mm), Type: Board Level, Shape: Square, Pin Fins, Length: 1.575" (40.00mm), Material: Aluminum, Packaging: Bulk.
Інші пропозиції 375124B60024G
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
 |
375124B60024G | Boyd Laconia, LLC |
Description: HEATSINK BGA W/O SOLDER ANCHORS Material Finish: Black Anodized Fin Height: 0.984" (25.00mm) Thermal Resistance @ Natural: 10.30°C/W Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM Power Dissipation @ Temperature Rise: 8.0W @ 80°C Attachment Method: Solder Anchor Package Cooled: BGA Width: 1.575" (40.01mm) Type: Board Level Shape: Square, Pin Fins Length: 1.575" (40.00mm) Material: Aluminum Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 672 шт В кошику од. на суму грн. |
| 375124B60024G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA W/O SOLDER ANCHORS
Material Finish: Black Anodized
Fin Height: 0.984" (25.00mm)
Thermal Resistance @ Natural: 10.30°C/W
Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 8.0W @ 80°C
Attachment Method: Solder Anchor
Package Cooled: BGA
Width: 1.575" (40.01mm)
Type: Board Level
Shape: Square, Pin Fins
Length: 1.575" (40.00mm)
Material: Aluminum
Packaging: Bulk
Description: HEATSINK BGA W/O SOLDER ANCHORS
Material Finish: Black Anodized
Fin Height: 0.984" (25.00mm)
Thermal Resistance @ Natural: 10.30°C/W
Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 8.0W @ 80°C
Attachment Method: Solder Anchor
Package Cooled: BGA
Width: 1.575" (40.01mm)
Type: Board Level
Shape: Square, Pin Fins
Length: 1.575" (40.00mm)
Material: Aluminum
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 672 шт
В кошику
од. на суму грн.