Технічний опис 40-0518-11H Aries Electronics
Description: CONN SOCKET SIP 40POS GOLD, Contact Material - Post: Brass, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 40 (1 x 40), Type: SIP, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bulk.
Інші пропозиції 40-0518-11H
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| 40-0518-11H | Aries Electronics |
Description: CONN SOCKET SIP 40POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 40 (1 x 40) Type: SIP Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 57 шт В кошику од. на суму грн. |
| 40-0518-11H |
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Виробник: Aries Electronics
Description: CONN SOCKET SIP 40POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (1 x 40)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN SOCKET SIP 40POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (1 x 40)
Type: SIP
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 57 шт
В кошику
од. на суму грн.



