Технічний опис 40-516-11S Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS GLD, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 40 (2 x 20), Type: DIP, ZIF (ZIP), Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Інші пропозиції 40-516-11S за ціною від 1584.69 грн до 1584.69 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||
|---|---|---|---|---|---|---|---|
| 40-516-11S | Aries Electronics |
 Description: CONN IC DIP SOCKET ZIF 40POS GLDPart Status: Active Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 40 (2 x 20) Type: DIP, ZIF (ZIP) Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
|
| 40-516-11S |
|
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Type: DIP, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Type: DIP, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1584.69 грн |