42-6556-41 Aries Electronics

Description: CONN IC DIP SOCKET 42POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 42 (2 x 21), Termination: Solder Cup, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass.