44764-2203 MOLEX
Виробник: MOLEX
Category: Raster signal connectors 3,00mm
Description: Connector: wire-board; socket; female; PIN: 22; MICRO; Inom: 5A; THT
Type of connector: wire-board
Connector: socket
Kind of connector: female
Number of pins: 22
Manufacturer series: MICRO
Spatial orientation: angled
Electrical mounting: THT
Mechanical mounting: on PCBs
Contacts pitch: 3mm
Contact plating: gold-plated
Maximum current: 8.5A
Max. voltage: 0.6kV
Contact material: phosphor bronze
Flammability rating: UL94V-0
Current rating: 5A
Body colour: black
Operating temperature: -40...105°C
Body material: polyamide
| Кількість | Ціна без ПДВ |
|---|---|
| 11+ | 615.21 грн |
| 55+ | 514.05 грн |
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Технічний опис 44764-2203 MOLEX
Description: MICRO-FIT BMI RECEPTACLE HEADER,, Features: Blind Mating, Board Guide, Packaging: Box, Connector Type: Receptacle, Voltage Rating: 600VAC/DC, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Through Hole, Right Angle, Number of Positions: 22, Style: Board to Board or Cable, Operating Temperature: -40°C ~ 105°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.118" (3.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Part Status: Active, Contact Length - Post: 0.155" (3.94mm), Insulation Height: 0.410" (10.41mm), Row Spacing - Mating: 0.118" (3.00mm), Number of Rows: 2.
Інші пропозиції 44764-2203 за ціною від 619.75 грн до 918.38 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
44764-2203 | Molex |
Description: MICRO-FIT BMI RECEPTACLE HEADER, Features: Blind Mating, Board Guide Packaging: Box Connector Type: Receptacle Voltage Rating: 600VAC/DC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Through Hole, Right Angle Number of Positions: 22 Style: Board to Board or Cable Operating Temperature: -40°C ~ 105°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.155" (3.94mm) Insulation Height: 0.410" (10.41mm) Row Spacing - Mating: 0.118" (3.00mm) Number of Rows: 2 |
на замовлення 281 шт: термін постачання 21-31 дні (днів) |
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44764-2203 | Molex |
Conn Wire to Board RCP 22 POS 3mm Solder RA Side Entry Thru-Hole Micro-Fit 3.0 BMI Tray |
на замовлення 616 шт: термін постачання 21-31 дні (днів) |
|
| 44764-2203 |
|
Виробник: Molex
Description: MICRO-FIT BMI RECEPTACLE HEADER,
Features: Blind Mating, Board Guide
Packaging: Box
Connector Type: Receptacle
Voltage Rating: 600VAC/DC
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Through Hole, Right Angle
Number of Positions: 22
Style: Board to Board or Cable
Operating Temperature: -40°C ~ 105°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.155" (3.94mm)
Insulation Height: 0.410" (10.41mm)
Row Spacing - Mating: 0.118" (3.00mm)
Number of Rows: 2
Description: MICRO-FIT BMI RECEPTACLE HEADER,
Features: Blind Mating, Board Guide
Packaging: Box
Connector Type: Receptacle
Voltage Rating: 600VAC/DC
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Through Hole, Right Angle
Number of Positions: 22
Style: Board to Board or Cable
Operating Temperature: -40°C ~ 105°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.155" (3.94mm)
Insulation Height: 0.410" (10.41mm)
Row Spacing - Mating: 0.118" (3.00mm)
Number of Rows: 2
на замовлення 281 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 10+ | 726.09 грн |
| 40+ | 687.26 грн |
| 80+ | 673.83 грн |
| 200+ | 619.75 грн |
| 44764-2203 |
|
Виробник: Molex
Conn Wire to Board RCP 22 POS 3mm Solder RA Side Entry Thru-Hole Micro-Fit 3.0 BMI Tray
Conn Wire to Board RCP 22 POS 3mm Solder RA Side Entry Thru-Hole Micro-Fit 3.0 BMI Tray
на замовлення 616 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 16+ | 918.38 грн |
| 35+ | 902.36 грн |
| 70+ | 885.38 грн |
| 150+ | 840.12 грн |