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Технічний опис 4727 Keystone Electronics
Description: SMT SOCKET - WIDE SOIC-16, Features: Closed Frame, Packaging: Bulk, Mounting Type: Surface Mount, Type: SOIC, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 100.0µin (2.54µm), Contact Material - Post: Copper Alloy, Part Status: Active.
Інші пропозиції 4727 за ціною від 467.58 грн до 530.02 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
||
|---|---|---|---|---|---|---|---|
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4727 | Adafruit Industries LLC |
Description: SMT SOCKET - WIDE SOIC-16Features: Closed Frame Packaging: Bulk Mounting Type: Surface Mount Type: SOIC Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Thermoplastic Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 100.0µin (2.54µm) Contact Material - Post: Copper Alloy Part Status: Active |
на замовлення 215 шт: термін постачання 21-31 дні (днів) |
|
||
|
4727 | Adafruit |
Adafruit Accessories SMT Socket - Wide SOIC-16 |
на замовлення 171 шт: термін постачання 21-30 дні (днів) |
|
| 4727 |
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Виробник: Adafruit Industries LLC
Description: SMT SOCKET - WIDE SOIC-16
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Material - Post: Copper Alloy
Part Status: Active
Description: SMT SOCKET - WIDE SOIC-16
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Material - Post: Copper Alloy
Part Status: Active
на замовлення 215 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 467.58 грн |




