4808-3004-CP 3M
Виробник: 3M
Description: 3M - 4808-3004-CP - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, 4800, 7.62 mm, Phosphorbronze
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
usEccn: EAR99
Anzahl der Kontakte: 8Kontakt(e)
euEccn: NLR
Reihenabstand: 7.62mm
Steckverbinder: DIP-Sockel
Produktpalette: 4800
productTraceability: No
Rastermaß: 2.54mm
| Кількість | Ціна |
|---|---|
| 19+ | 44.47 грн |
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Технічний опис 4808-3004-CP 3M
Description: CONN IC DIP SOCKET 8POS TIN, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -25°C ~ 85°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 35.4µin (0.90µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 35.0µin (0.90µm), Contact Material - Post: Phosphor Bronze, Part Status: Active.
Інші пропозиції 4808-3004-CP за ціною від 21.80 грн до 67.25 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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4808-3004-CP | 3M Electronic Solutions Division |
IC & Component Sockets 8P DUAL WIPE DIPSKT |
на замовлення 9981 шт: термін постачання 21-30 дні (днів) |
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4808-3004-CP | 3M |
Description: CONN IC DIP SOCKET 8POS TIN Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 26064 шт: термін постачання 21-31 дні (днів) |
|
| 4808-3004-CP |
|
Виробник: 3M Electronic Solutions Division
IC & Component Sockets 8P DUAL WIPE DIPSKT
IC & Component Sockets 8P DUAL WIPE DIPSKT
на замовлення 9981 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 7+ | 54.15 грн |
| 10+ | 39.63 грн |
| 100+ | 30.10 грн |
| 500+ | 28.97 грн |
| 1000+ | 23.84 грн |
| 2500+ | 21.80 грн |
| 4808-3004-CP |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 8POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 8POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 26064 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5+ | 67.25 грн |
| 10+ | 55.16 грн |
| 25+ | 51.68 грн |
| 50+ | 46.20 грн |
| 100+ | 43.99 грн |
| 250+ | 41.24 грн |
| 500+ | 38.62 грн |
| 1000+ | 36.78 грн |
| 2500+ | 34.48 грн |