4818-3004-CP 3M Electronic Solutions Division
| Кількість | Ціна |
|---|---|
| 7+ | 52.92 грн |
| 10+ | 41.00 грн |
| 25+ | 32.84 грн |
| 100+ | 32.00 грн |
| 250+ | 30.03 грн |
| 500+ | 29.04 грн |
| 1000+ | 25.88 грн |
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Технічний опис 4818-3004-CP 3M Electronic Solutions Division
Description: CONN IC DIP SOCKET 18POS TIN, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -25°C ~ 85°C, Number of Positions or Pins (Grid): 18 (2 x 9), Termination: Solder, Housing Material: Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 35.4µin (0.90µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 35.0µin (0.90µm), Contact Material - Post: Phosphor Bronze, Part Status: Active.
Інші пропозиції 4818-3004-CP за ціною від 27.04 грн до 53.01 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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4818-3004-CP | 3M |
 Description: CONN IC DIP SOCKET 18POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 8556 шт: термін постачання 21-31 дні (днів) |
|
| 4818-3004-CP |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 18POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 18POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 8556 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 6+ | 53.01 грн |
| 22+ | 40.93 грн |
| 44+ | 38.98 грн |
| 66+ | 35.54 грн |
| 110+ | 34.29 грн |
| 264+ | 32.23 грн |
| 506+ | 30.28 грн |
| 1012+ | 28.83 грн |
| 2508+ | 27.04 грн |