4820-3004-CP 3M Electronic Solutions Division
| Кількість | Ціна |
|---|---|
| 7+ | 52.92 грн |
| 10+ | 41.33 грн |
| 25+ | 33.05 грн |
| 100+ | 32.21 грн |
| 250+ | 30.45 грн |
| 500+ | 28.76 грн |
| 1000+ | 25.32 грн |
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Технічний опис 4820-3004-CP 3M Electronic Solutions Division
Description: CONN IC DIP SOCKET 20POS TIN, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -25°C ~ 85°C, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Solder, Housing Material: Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 35.4µin (0.90µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 35.0µin (0.90µm), Contact Material - Post: Phosphor Bronze, Part Status: Active.
Інші пропозиції 4820-3004-CP за ціною від 27.05 грн до 53.01 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
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4820-3004-CP | 3M |
 Description: CONN IC DIP SOCKET 20POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -25°C ~ 85°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 35.4µin (0.90µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 35.0µin (0.90µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 8697 шт: термін постачання 21-31 дні (днів) |
|
| 4820-3004-CP |
|
Виробник: 3M
Description: CONN IC DIP SOCKET 20POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN IC DIP SOCKET 20POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -25°C ~ 85°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35.4µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35.0µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 8697 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 53.01 грн |
| 20+ | 41.22 грн |
| 40+ | 39.24 грн |
| 60+ | 35.80 грн |
| 100+ | 34.52 грн |
| 260+ | 32.27 грн |
| 500+ | 30.30 грн |
| 1000+ | 28.86 грн |
| 2500+ | 27.05 грн |