5-1571552-6 TE CONNECTIVITY / PARTNER STOCK
Виробник: TE CONNECTIVITY / PARTNER STOCK
Description: TE CONNECTIVITY / PARTNER STOCK - 5-1571552-6 - IC- & Baustein-Sockel, 24 Kontakt(e), DIP-Sockel, 2.54 mm, DIPLOMATE 800, 7.62 mm
tariffCode: 85369010
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 24Kontakt(e)
SVHC: To Be Advised
Reihenabstand: 7.62mm
Steckverbinder: DIP-Sockel
Produktpalette: DIPLOMATE 800
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
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Технічний опис 5-1571552-6 TE CONNECTIVITY / PARTNER STOCK
Description: CONN IC DIP SOCKET 24POS GOLD, Part Status: Obsolete, Contact Material - Post: Copper, Contact Finish Thickness - Post: 20.0µin (0.51µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 24 (2 x 12), Operating Temperature: -55°C ~ 105°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.
Інші пропозиції 5-1571552-6
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
 |
5-1571552-6 | TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 24POS GOLD Part Status: Obsolete Contact Material - Post: Copper Contact Finish Thickness - Post: 20.0µin (0.51µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -55°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 800 шт В кошику од. на суму грн. |
| 5-1571552-6 |
|
Виробник: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Obsolete
Contact Material - Post: Copper
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Obsolete
Contact Material - Post: Copper
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 800 шт
В кошику
од. на суму грн.