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Технічний опис 502382-1472 Molex
Description: 1.25W/BSGLSTRECASSY14CKTEMBSTPPK, Features: Pick and Place, Solder Retention, Packaging: Bulk, Connector Type: Receptacle, Voltage Rating: 50V, Current Rating (Amps): 1A, Mounting Type: Surface Mount, Number of Positions: 14, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Forked, Fastening Type: Latch Holder, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Natural, Pitch - Mating: 0.049" (1.25mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 39.4µin (1.00µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.173" (4.40mm), Number of Rows: 1.
Інші пропозиції 502382-1472 за ціною від 114.94 грн до 135.14 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||
|---|---|---|---|---|---|---|---|
| 502382-1472 | Molex |
Description: 1.25W/BSGLSTRECASSY14CKTEMBSTPPK Features: Pick and Place, Solder Retention Packaging: Bulk Connector Type: Receptacle Voltage Rating: 50V Current Rating (Amps): 1A Mounting Type: Surface Mount Number of Positions: 14 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Forked Fastening Type: Latch Holder Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Natural Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.173" (4.40mm) Number of Rows: 1 |
на замовлення 3057 шт: термін постачання 21-31 дні (днів) |
|
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| 5023821472 | Molex |
 Conn Wire to Board RCP 14 POS 1.25mm Solder ST SMD T/R |
на замовлення 2800 шт: термін постачання 21-31 дні (днів) |
|
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| 502382-1472 | MOLEX / PARTNER STOCK |
Description: MOLEX / PARTNER STOCK - 502382-1472 - Printbuchse, Wire-to-Board, 1.25 mm, 1 Reihe(n), 14 Kontakt(e), Oberflächenmontage, gerade tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Kupferlegierung isCanonical: Y Steckverbindermontage: Oberflächenmontage, gerade Anzahl der Kontakte: 14Kontakt(e) SVHC: No SVHC (04-Feb-2026) Steckverbindersysteme: Wire-to-Board Produktpalette: CLIK-Mate 502382 Series productTraceability: No usEccn: EAR99 Anzahl der Reihen: 1Reihe(n) Rastermaß: 1.25mm |
на замовлення 5600 шт: термін постачання 21-31 дні (днів) |
Мінімальне замовлення: 1400 шт В кошику од. на суму грн. |
| 502382-1472 |
Виробник: Molex
Description: 1.25W/BSGLSTRECASSY14CKTEMBSTPPK
Features: Pick and Place, Solder Retention
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 50V
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 14
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Forked
Fastening Type: Latch Holder
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.173" (4.40mm)
Number of Rows: 1
Description: 1.25W/BSGLSTRECASSY14CKTEMBSTPPK
Features: Pick and Place, Solder Retention
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 50V
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 14
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Forked
Fastening Type: Latch Holder
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.173" (4.40mm)
Number of Rows: 1
на замовлення 3057 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1400+ | 114.94 грн |
| 5023821472 |
|
Виробник: Molex
Conn Wire to Board RCP 14 POS 1.25mm Solder ST SMD T/R
Conn Wire to Board RCP 14 POS 1.25mm Solder ST SMD T/R
на замовлення 2800 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1400+ | 135.14 грн |
| 502382-1472 |
|
Виробник: MOLEX / PARTNER STOCK
Description: MOLEX / PARTNER STOCK - 502382-1472 - Printbuchse, Wire-to-Board, 1.25 mm, 1 Reihe(n), 14 Kontakt(e), Oberflächenmontage, gerade
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupferlegierung
isCanonical: Y
Steckverbindermontage: Oberflächenmontage, gerade
Anzahl der Kontakte: 14Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Wire-to-Board
Produktpalette: CLIK-Mate 502382 Series
productTraceability: No
usEccn: EAR99
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 1.25mm
Description: MOLEX / PARTNER STOCK - 502382-1472 - Printbuchse, Wire-to-Board, 1.25 mm, 1 Reihe(n), 14 Kontakt(e), Oberflächenmontage, gerade
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupferlegierung
isCanonical: Y
Steckverbindermontage: Oberflächenmontage, gerade
Anzahl der Kontakte: 14Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Wire-to-Board
Produktpalette: CLIK-Mate 502382 Series
productTraceability: No
usEccn: EAR99
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 1.25mm
на замовлення 5600 шт:
термін постачання 21-31 дні (днів)