на замовлення 4860 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 6+ | 66.67 грн |
| 10+ | 55.56 грн |
| 25+ | 45.22 грн |
| 100+ | 43.33 грн |
| 270+ | 38.95 грн |
| 540+ | 35.48 грн |
| 1080+ | 31.48 грн |
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Технічний опис 503159-0910 Molex
Description: 1.5W/BSGLDIPSTRECASSY9CKTW/OBOSW, Packaging: Bulk, Features: Board Guide, Connector Type: Receptacle, Voltage Rating: 100VAC/DC, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Through Hole, Number of Positions: 9, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Forked, Fastening Type: Detent Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Natural, Pitch - Mating: 0.059" (1.50mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 39.4µin (1.00µm), Contact Finish - Post: Tin, Contact Length - Post: 0.134" (3.40mm), Insulation Height: 0.313" (7.95mm), Number of Rows: 1.
Інші пропозиції 503159-0910
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
5031590910 | Виробник : Molex |
 Conn Wire to Board RCP 9 POS 3mm Solder ST Thru-Hole CLIK-Mate™ Tray |
товару немає в наявності |
|
| 5031590910 | Виробник : Molex |
Description: 1.5W/BSGLDIPSTRECASSY9CKTW/OBOSW Packaging: Bulk Features: Board Guide Connector Type: Receptacle Voltage Rating: 100VAC/DC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Through Hole Number of Positions: 9 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Forked Fastening Type: Detent Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Natural Pitch - Mating: 0.059" (1.50mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Tin Contact Length - Post: 0.134" (3.40mm) Insulation Height: 0.313" (7.95mm) Number of Rows: 1 |
товару немає в наявності |