Інші пропозиції 504194-0370 за ціною від 35.47 грн до 80.09 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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5041940370 | Molex |
Description: CONN HEADER SMD 3POS 1.25MMInsulation Material: Polyamide (PA), Nylon, Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.163" (4.15mm) Contact Shape: Rectangular Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Mating: Tin Insulation Color: Natural Contact Material: Brass Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Latch Lock Contact Type: Male Blade Style: Board to Cable/Wire Number of Rows: 1 Number of Positions: 3 Mounting Type: Surface Mount Connector Type: Header Packaging: Tape & Reel (TR) Pitch - Mating: 0.049" (1.25mm) Features: Solder Retention |
на замовлення 7200 шт: термін постачання 21-31 дні (днів) |
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504194-0370 | MOLEX / PARTNER STOCK |
Description: MOLEX / PARTNER STOCK - 504194-0370 - Stiftleiste, Wire-to-Board, 1.25 mm, 1 Reihe(n), 3 Kontakt(e), Oberflächenmontage tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Messing isCanonical: Y usEccn: EAR99 Steckverbinderkragen: - Anzahl der Kontakte: 3Kontakt(e) euEccn: NLR Steckverbindersysteme: Wire-to-Board Steckverbinder: - Produktpalette: Micro-Lock 504194 Series productTraceability: No Kontaktanschluss: Oberflächenmontage Anzahl der Reihen: 1Reihe(n) Rastermaß: 1.25mm SVHC: No SVHC (04-Feb-2026) |
на замовлення 79200 шт: термін постачання 21-31 дні (днів) |
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|
5041940370 | Molex |
Description: CONN HEADER SMD 3POS 1.25MMInsulation Material: Polyamide (PA), Nylon, Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.163" (4.15mm) Contact Shape: Rectangular Contact Finish - Post: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Mating: Tin Pitch - Mating: 0.049" (1.25mm) Insulation Color: Natural Contact Material: Brass Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Latch Lock Contact Type: Male Blade Style: Board to Cable/Wire Number of Rows: 1 Number of Positions: 3 Mounting Type: Surface Mount Connector Type: Header Features: Solder Retention Packaging: Cut Tape (CT) Part Status: Active |
на замовлення 7554 шт: термін постачання 21-31 дні (днів) |
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| 504194-0370 | Molex | Description: MICRO-LOCK 1.25 W/B VERT HDR 3CK |
на замовлення 3600 шт: термін постачання 21-31 дні (днів) |
Мінімальне замовлення: 1200 шт В кошику од. на суму грн. |
| 5041940370 |
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Виробник: Molex
Description: CONN HEADER SMD 3POS 1.25MM
Insulation Material: Polyamide (PA), Nylon, Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.163" (4.15mm)
Contact Shape: Rectangular
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Mating: Tin
Insulation Color: Natural
Contact Material: Brass
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Latch Lock
Contact Type: Male Blade
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 3
Mounting Type: Surface Mount
Connector Type: Header
Packaging: Tape & Reel (TR)
Pitch - Mating: 0.049" (1.25mm)
Features: Solder Retention
Description: CONN HEADER SMD 3POS 1.25MM
Insulation Material: Polyamide (PA), Nylon, Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.163" (4.15mm)
Contact Shape: Rectangular
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Mating: Tin
Insulation Color: Natural
Contact Material: Brass
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Latch Lock
Contact Type: Male Blade
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 3
Mounting Type: Surface Mount
Connector Type: Header
Packaging: Tape & Reel (TR)
Pitch - Mating: 0.049" (1.25mm)
Features: Solder Retention
на замовлення 7200 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1200+ | 43.97 грн |
| 2400+ | 40.32 грн |
| 3600+ | 39.19 грн |
| 6000+ | 35.47 грн |
| 504194-0370 |
Виробник: MOLEX / PARTNER STOCK
Description: MOLEX / PARTNER STOCK - 504194-0370 - Stiftleiste, Wire-to-Board, 1.25 mm, 1 Reihe(n), 3 Kontakt(e), Oberflächenmontage
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Messing
isCanonical: Y
usEccn: EAR99
Steckverbinderkragen: -
Anzahl der Kontakte: 3Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Wire-to-Board
Steckverbinder: -
Produktpalette: Micro-Lock 504194 Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 1.25mm
SVHC: No SVHC (04-Feb-2026)
Description: MOLEX / PARTNER STOCK - 504194-0370 - Stiftleiste, Wire-to-Board, 1.25 mm, 1 Reihe(n), 3 Kontakt(e), Oberflächenmontage
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Messing
isCanonical: Y
usEccn: EAR99
Steckverbinderkragen: -
Anzahl der Kontakte: 3Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Wire-to-Board
Steckverbinder: -
Produktpalette: Micro-Lock 504194 Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 1.25mm
SVHC: No SVHC (04-Feb-2026)
на замовлення 79200 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1200+ | 51.80 грн |
| 3600+ | 48.68 грн |
| 5041940370 |
![]() |
Виробник: Molex
Description: CONN HEADER SMD 3POS 1.25MM
Insulation Material: Polyamide (PA), Nylon, Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.163" (4.15mm)
Contact Shape: Rectangular
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.049" (1.25mm)
Insulation Color: Natural
Contact Material: Brass
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Latch Lock
Contact Type: Male Blade
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 3
Mounting Type: Surface Mount
Connector Type: Header
Features: Solder Retention
Packaging: Cut Tape (CT)
Part Status: Active
Description: CONN HEADER SMD 3POS 1.25MM
Insulation Material: Polyamide (PA), Nylon, Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.163" (4.15mm)
Contact Shape: Rectangular
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.049" (1.25mm)
Insulation Color: Natural
Contact Material: Brass
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Latch Lock
Contact Type: Male Blade
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 3
Mounting Type: Surface Mount
Connector Type: Header
Features: Solder Retention
Packaging: Cut Tape (CT)
Part Status: Active
на замовлення 7554 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 4+ | 80.09 грн |
| 10+ | 63.30 грн |
| 100+ | 51.58 грн |
| 500+ | 41.96 грн |
| 504194-0370 |
Виробник: Molex
Description: MICRO-LOCK 1.25 W/B VERT HDR 3CK
Description: MICRO-LOCK 1.25 W/B VERT HDR 3CK
на замовлення 3600 шт:
термін постачання 21-31 дні (днів)




