505433-1881 MOLEX
Виробник: MOLEX
Description: MOLEX - 505433-1881 - Stiftleiste, Signal, Wire-to-Board, 1.25 mm, 2 Reihe(n), 18 Kontakt(e)
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Kontakte beschichtet mit Zinn-Wismut
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Messing
usEccn: EAR99
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 18Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Signal, Wire-to-Board
Steckverbindertyp: PCB-Stiftleiste
Produktpalette: Micro-Lock Plus 505433 Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.25mm
SVHC: No SVHC (21-Jan-2025)
Description: MOLEX - 505433-1881 - Stiftleiste, Signal, Wire-to-Board, 1.25 mm, 2 Reihe(n), 18 Kontakt(e)
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Kontakte beschichtet mit Zinn-Wismut
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Messing
usEccn: EAR99
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 18Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Signal, Wire-to-Board
Steckverbindertyp: PCB-Stiftleiste
Produktpalette: Micro-Lock Plus 505433 Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.25mm
SVHC: No SVHC (21-Jan-2025)
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 500+ | 58.46 грн |
| 1500+ | 57.29 грн |
Відгуки про товар
Написати відгук
Технічний опис 505433-1881 MOLEX
Description: CONN HEADER SMD 18POS 1.25MM, Features: Pick and Place, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 50VAC/DC, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Number of Positions: 18, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Latch Holder, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass, Insulation Color: Black, Pitch - Mating: 0.049" (1.25mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 39.4µin (1.00µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.285" (7.25mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Polyamide (PA), Nylon.
Інші пропозиції 505433-1881 за ціною від 49.11 грн до 116.92 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
5054331881 | Виробник : Molex |
 Description: CONN HEADER SMD 18POS 1.25MMFeatures: Pick and Place, Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 50VAC/DC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 18 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Latch Holder Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.285" (7.25mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyamide (PA), Nylon |
на замовлення 7500 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
5054331881 | Виробник : Molex |
Description: CONN HEADER SMD 18POS 1.25MM Features: Pick and Place, Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 50VAC/DC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 18 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Latch Holder Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.285" (7.25mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyamide (PA), Nylon |
на замовлення 7931 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
505433-1881 | Виробник : MOLEX |
Description: MOLEX - 505433-1881 - Stiftleiste, Signal, Wire-to-Board, 1.25 mm, 2 Reihe(n), 18 Kontakt(e) tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Kontakte beschichtet mit Zinn-Wismut hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Messing usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 18Kontakt(e) euEccn: NLR Steckverbindersysteme: Signal, Wire-to-Board Steckverbindertyp: PCB-Stiftleiste Produktpalette: Micro-Lock Plus 505433 Series productTraceability: No Kontaktanschluss: Oberflächenmontage, gerade Anzahl der Reihen: 2Reihe(n) Rastermaß: 1.25mm SVHC: No SVHC (21-Jan-2025) |
на замовлення 3561 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
505433-1881 | Виробник : Molex | Headers & Wire Housings MicroLckPlus VRT HDR DR 18P BLK W/KAPTON |
на замовлення 5685 шт: термін постачання 21-30 дні (днів) |
|
||||||||||||||
 |
5054331881 | Виробник : Molex |
Conn Wire to Board HDR 18 POS 1.25mm Solder ST Top Entry SMD Micro-Lock Plus T/R |
товару немає в наявності |