5054331871 Molex
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2000+ | 63.41 грн |
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Технічний опис 5054331871 Molex
Description: CONN HEADER SMD 18POS 1.25MM, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 50VAC/DC, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Number of Positions: 18, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Latch Holder, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass, Insulation Color: Black, Pitch - Mating: 0.049" (1.25mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 39.4µin (1.00µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.285" (7.25mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Polyamide (PA), Nylon.
Інші пропозиції 5054331871 за ціною від 61.43 грн до 138.00 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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505433-1871 | Виробник : Molex |
 Conn Wire to Board HDR 18 POS 1.25mm Solder ST Top Entry SMD Micro-Lock Plus T/R |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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505433-1871 | Виробник : Molex |
Conn Wire to Board HDR 18 POS 1.25mm Solder ST Top Entry SMD Micro-Lock Plus T/R |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
 |
5054331871 | Виробник : Molex |
Description: CONN HEADER SMD 18POS 1.25MM Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 50VAC/DC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 18 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Latch Holder Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.285" (7.25mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyamide (PA), Nylon |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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5054331871 | Виробник : Molex |
Description: CONN HEADER SMD 18POS 1.25MM Packaging: Cut Tape (CT) Features: Solder Retention Connector Type: Header Voltage Rating: 50VAC/DC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 18 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Latch Holder Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.285" (7.25mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyamide (PA), Nylon |
на замовлення 2156 шт: термін постачання 21-31 дні (днів) |
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505433-1871 | Виробник : Molex | Headers & Wire Housings MicroLockPlus 1.25MM VRT HDR DR 18CKT BLK |
на замовлення 1863 шт: термін постачання 21-30 дні (днів) |
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505433-1871 | Виробник : Molex |
Conn Wire to Board HDR 18 POS 1.25mm Solder ST Top Entry SMD Micro-Lock Plus T/R |
товару немає в наявності |