5055680871 Molex
Виробник: Molex
Description: CONN HEADER SMD 8POS 1.25MM
Insulation Material: Polyamide (PA), Nylon, Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.165" (4.20mm)
Operating Temperature: -40°C ~ 105°C
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 8
Mounting Type: Surface Mount
Current Rating (Amps): Varies by Wire Gauge
Voltage Rating: 50VAC/DC
Connector Type: Header
Features: Solder Retention
Packaging: Tape & Reel (TR)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.049" (1.25mm)
Insulation Color: Black
Contact Material: Brass
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
| Кількість | Ціна |
|---|---|
| 1200+ | 47.88 грн |
| 2400+ | 43.91 грн |
| 3600+ | 42.67 грн |
| 6000+ | 38.63 грн |
| 8400+ | 37.72 грн |
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Технічний опис 5055680871 Molex
Description: CONN HEADER SMD 8POS 1.25MM, Insulation Material: Polyamide (PA), Nylon, Glass Filled, Shrouding: Shrouded - 4 Wall, Insulation Height: 0.165" (4.20mm), Operating Temperature: -40°C ~ 105°C, Style: Board to Cable/Wire, Number of Rows: 1, Number of Positions: 8, Mounting Type: Surface Mount, Current Rating (Amps): Varies by Wire Gauge, Voltage Rating: 50VAC/DC, Connector Type: Header, Features: Solder Retention, Packaging: Tape & Reel (TR), Contact Shape: Square, Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 39.4µin (1.00µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.049" (1.25mm), Insulation Color: Black, Contact Material: Brass, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin.
Інші пропозиції 5055680871 за ціною від 35.94 грн до 95.17 грн
| Фото | Назва | Виробник | Інформація |
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5055680871 | Виробник : Molex |
Description: CONN HEADER SMD 8POS 1.25MM Number of Positions: 8 Mounting Type: Surface Mount Current Rating (Amps): Varies by Wire Gauge Voltage Rating: 50VAC/DC Connector Type: Header Features: Solder Retention Packaging: Cut Tape (CT) Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Mating: Tin Pitch - Mating: 0.049" (1.25mm) Insulation Color: Black Contact Material: Brass Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Male Pin Operating Temperature: -40°C ~ 105°C Style: Board to Cable/Wire Number of Rows: 1 Insulation Material: Polyamide (PA), Nylon, Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.165" (4.20mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin |
на замовлення 10709 шт: термін постачання 21-31 дні (днів) |
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505568-0871 | Виробник : Molex | Headers & Wire Housings MicroLockPlus 1.25MM VERT HDR SR 8CKT BL |
на замовлення 14702 шт: термін постачання 21-30 дні (днів) |
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505568-0871 | Виробник : MOLEX |
Description: MOLEX - 505568-0871 - Stiftleiste, Signal, Wire-to-Board, 1.25 mm, 1 Reihe(n), 8 Kontakt(e), Oberflächenmontage, gerade tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Kontakte beschichtet mit Zinn-Wismut hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Messing isCanonical: Y usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 8Kontakt(e) euEccn: NLR Steckverbindersysteme: Signal, Wire-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: Micro-Lock Plus 505568 Series productTraceability: No Kontaktanschluss: Oberflächenmontage, gerade Anzahl der Reihen: 1Reihe(n) Rastermaß: 1.25mm SVHC: No SVHC (04-Feb-2026) |
на замовлення 2670 шт: термін постачання 21-31 дні (днів) |
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