510-87-032-09-041101 Preci-Dip
Виробник: Preci-Dip
Description: CONN SOCKET PGA 32POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (9 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 32POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (9 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
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Технічний опис 510-87-032-09-041101 Preci-Dip
Description: CONN SOCKET PGA 32POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 32 (9 x 9), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass.
Інші пропозиції 510-87-032-09-041101
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 510-87-032-09-041101 | Виробник : Preci-dip |
 IC & Component Sockets |
товару немає в наявності |