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511-93-059-11-001002

511-93-059-11-001002 Mill-Max Mfg. Corp.


511-93-059-11-001002.pdf Виробник: Mill-Max Mfg. Corp.
Conn PGA Socket SKT 59 POS Solder ST Thru-Hole
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Технічний опис 511-93-059-11-001002 Mill-Max Mfg. Corp.

Description: SKT PGA SOLDRTL, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: PGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 59 (11 x 11), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy.

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511-93-059-11-001002 Виробник : Mill-Max Manufacturing Corp. 2017-11%3A138.pdf Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 59 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
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511-93-059-11-001002 Виробник : Mill-Max mill-max_mmmcd002-37-1738098.pdf Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET
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