514-83-256M16-000148 Preci-Dip

Description: CONN SOCKET BGA 256POS GOLD, Part Status: Active, Contact Material - Post: Brass, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 256 (16 x 16), Operating Temperature: -55°C ~ 125°C, Type: BGA, Mounting Type: Surface Mount, Features: Open Frame, Packaging: Bulk.