514-83-256M16-000148 Preci-Dip

Description: CONN SOCKET BGA 256POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Surface Mount, Type: BGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 256 (16 x 16), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass, Part Status: Active.