Продукція > PRECI-DIP > 514-83-257-20-111117
514-83-257-20-111117

514-83-257-20-111117 Preci-Dip


catalog.pdf Виробник: Preci-Dip
Conn BGA Socket SKT 257 POS 2.54mm Solder ST SMD T/R
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Технічний опис 514-83-257-20-111117 Preci-Dip

Description: CONN SOCKET PGA 257POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Surface Mount, Type: PGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 257 (20 x 20), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass, Part Status: Active.

Інші пропозиції 514-83-257-20-111117

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514-83-257-20-111117 Виробник : Preci-Dip Default.aspx?c=12&i=1300&p=284&pdf=1&dsku=514-PP-NNN-XX-XXX117 Description: CONN SOCKET PGA 257POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 257 (20 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
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514-83-257-20-111117 Виробник : Preci-dip preci-dip_pdsas00046-1-1746933.pdf Board to Board & Mezzanine Connectors
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