54112-109081700LF Amphenol Communications Solutions-FCI
Виробник: Amphenol Communications Solutions-FCI
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch
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Технічний опис 54112-109081700LF Amphenol Communications Solutions-FCI
Description: CONN HDR 8POS 0.1" STACK T/H, Number of Rows: 2, Part Status: Active, Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm), Contact Finish - Post (Mating): Gold, GXT™, Termination: Solder, Row Spacing: 0.100" (2.54mm), Packaging: Bulk, Length - Tail: 0.095" (2.413mm), Length - Stack Height: 0.669" (17.000mm), Length - Post (Mating): 0.261" (6.629mm), Length - Overall Pin: 1.025" (26.035mm), Number of Positions: 8, Pitch: 0.100" (2.54mm), Mounting Type: Through Hole, Color: Black.
Інші пропозиції 54112-109081700LF
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
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54112-109081700LF | Amphenol Communications Solutions-FCI |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch |
на замовлення 293 шт: термін постачання 21-31 дні (днів) |
Мінімальне замовлення: 14 шт В кошику од. на суму грн. |
| 54112-109081700LF |
|
Виробник: Amphenol Communications Solutions-FCI
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch
на замовлення 293 шт:
термін постачання 21-31 дні (днів)