558-10-256M20-001104 Preci-Dip
Виробник: Preci-DipDescription: BGA SURFACE MOUNT 1.27MM
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: BGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 256 (20 x 20)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Brass
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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Технічний опис 558-10-256M20-001104 Preci-Dip
Description: BGA SURFACE MOUNT 1.27MM, Packaging: Bulk, Features: Closed Frame, Mounting Type: Surface Mount, Type: BGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 256 (20 x 20), Termination: Solder, Housing Material: FR4 Epoxy Glass, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Brass, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass.
Інші пропозиції 558-10-256M20-001104
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
| 558-10-256M20-001104 | Виробник : Preci-dip |
IC & Component Sockets |
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