560020-0823 MOLEX
Виробник: MOLEX
Description: MOLEX - 560020-0823 - Stiftleiste, Wire-to-Board, 2 mm, 1 Reihe(n), 8 Kontakt(e), Oberflächenmontage, gerade
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupferlegierung
usEccn: EAR99
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 8Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Wire-to-Board
Steckverbindertyp: PCB Header
Produktpalette: DuraClik 560020
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 2mm
SVHC: No SVHC (23-Jan-2024)
Description: MOLEX - 560020-0823 - Stiftleiste, Wire-to-Board, 2 mm, 1 Reihe(n), 8 Kontakt(e), Oberflächenmontage, gerade
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupferlegierung
usEccn: EAR99
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 8Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Wire-to-Board
Steckverbindertyp: PCB Header
Produktpalette: DuraClik 560020
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 2mm
SVHC: No SVHC (23-Jan-2024)
на замовлення 1074 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 15+ | 60.54 грн |
| 18+ | 48.78 грн |
| 50+ | 46.20 грн |
| 100+ | 40.27 грн |
| 500+ | 35.55 грн |
| 1000+ | 33.93 грн |
Відгуки про товар
Написати відгук
Технічний опис 560020-0823 MOLEX
Description: 2.0 W/B SMT ST 8CKT EMBOSSED TP, Packaging: Bulk, Connector Type: Header, Voltage Rating: 125VAC/DC, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Number of Positions: 8, Number of Rows: 1, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Friction Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Copper Alloy, Insulation Color: Blue, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Tin, Contact Finish - Post: Gold, Contact Shape: Square, Insulation Height: 0.315" (8.00mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Polyamide (PA), Nylon.
Інші пропозиції 560020-0823
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
5600200823 | Виробник : Molex |
 Description: 2.0 W/B SMT ST 8CKT EMBOSSED TPPackaging: Bulk Connector Type: Header Voltage Rating: 125VAC/DC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 8 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Friction Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Blue Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Tin Contact Finish - Post: Gold Contact Shape: Square Insulation Height: 0.315" (8.00mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyamide (PA), Nylon |
товару немає в наявності |