6032DG Boyd Laconia, LLC
Виробник: Boyd Laconia, LLC
Description: HEAT SINK
Part Status: Active
Material Finish: Tin
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 8.30°C/W
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 6.0W @ 60°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 1.380" (35.05mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.000" (50.80mm)
Material: Copper
Packaging: Bulk
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Технічний опис 6032DG Boyd Laconia, LLC
Description: HEAT SINK, Part Status: Active, Material Finish: Tin, Fin Height: 0.500" (12.70mm), Thermal Resistance @ Natural: 8.30°C/W, Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 6.0W @ 60°C, Attachment Method: Bolt On and PC Pin, Package Cooled: TO-220, Width: 1.380" (35.05mm), Type: Board Level, Vertical, Shape: Rectangular, Fins, Length: 2.000" (50.80mm), Material: Copper, Packaging: Bulk.
