614-43-328-31-012000

614-43-328-31-012000 Mill-Max Manufacturing Corp.


2017-11%3A115.pdf Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 112 шт:

термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+459.72 грн
10+ 400.29 грн
25+ 378.19 грн
50+ 346.24 грн
100+ 328.93 грн
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Технічний опис 614-43-328-31-012000 Mill-Max Manufacturing Corp.

Description: CONN IC DIP SOCKET 28POS GOLD, Packaging: Tube, Features: Carrier, Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.

Інші пропозиції 614-43-328-31-012000

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Ціна без ПДВ
614-43-328-31-012000 Виробник : Mill-Max MMMCS17801_1-2552338.pdf IC & Component Sockets 28 PIN CARRIER
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