| Кількість | Ціна |
|---|---|
| 4+ | 99.39 грн |
| 10+ | 83.51 грн |
| 25+ | 67.87 грн |
| 104+ | 64.73 грн |
| 260+ | 58.66 грн |
| 520+ | 53.28 грн |
| 1040+ | 47.34 грн |
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Технічний опис 614-87-308-31-012101 Preci-dip
Description: CONN IC DIP SOCKET 8POS GOLD, Contact Finish Thickness - Mating: FLASH, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 8 (2 x 4), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Carrier, Open Frame, Packaging: Bulk, Contact Material - Post: Brass, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper.
Інші пропозиції 614-87-308-31-012101
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
| 614-87-308-31-012101 | Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLDContact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Carrier, Open Frame Packaging: Bulk Contact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper |
товару немає в наявності |
Мінімальне замовлення: 5616 шт В кошику од. на суму грн. |
| 614-87-308-31-012101 |
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Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
товару немає в наявності
Мінімальне замовлення: 5616 шт
В кошику
од. на суму грн.


