| Кількість | Ціна |
|---|---|
| 1+ | 10262.17 грн |
| 10+ | 8877.66 грн |
| 25+ | 7573.39 грн |
| 50+ | 7447.28 грн |
| 100+ | 7296.10 грн |
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Технічний опис 68-PLS11033-12 Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Termination: Solder, Operating Temperature: -65°C ~ 125°C, Type: PGA, ZIF (ZIP), Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Інші пропозиції 68-PLS11033-12
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 68-PLS11033-12 | Виробник : Aries Electronics |
 Description: CONN SOCKET PGA ZIF GOLDPart Status: Active Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS) Termination: Solder Operating Temperature: -65°C ~ 125°C Type: PGA, ZIF (ZIP) Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
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