Технічний опис 714-43-210-31-018000 Mill-Max Mfg. Corp.
Description: CONN IC DIP SOCKET 10POS GOLD, Features: Carrier, Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.1" (2.54mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 10 (2 x 5), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Інші пропозиції 714-43-210-31-018000
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714-43-210-31-018000 | Виробник : Mill-Max Manufacturing Corp. |
![]() Features: Carrier, Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.1" (2.54mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
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714-43-210-31-018000 | Виробник : Mill-Max |
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товару немає в наявності |