7173DG Boyd Laconia, LLC
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEATSINK .375"TO-220
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 0.750" (19.05mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 0.750" (19.05mm)
Material: Copper
Packaging: Bulk
Part Status: Active
Material Finish: Tin
Fin Height: 0.375" (9.52mm)
Thermal Resistance @ Natural: 25.80°C/W
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 91.44 грн |
| 10+ | 78.28 грн |
| 25+ | 74.56 грн |
| 50+ | 67.47 грн |
| 100+ | 65.02 грн |
| 250+ | 61.93 грн |
| 500+ | 58.72 грн |
| 3000+ | 53.38 грн |
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Технічний опис 7173DG Boyd Laconia, LLC
Description: BOARD LEVEL HEATSINK .375"TO-220, Attachment Method: Bolt On and PC Pin, Package Cooled: TO-220, Width: 0.750" (19.05mm), Type: Board Level, Vertical, Shape: Rectangular, Fins, Length: 0.750" (19.05mm), Material: Copper, Packaging: Bulk, Part Status: Active, Material Finish: Tin, Fin Height: 0.375" (9.52mm), Thermal Resistance @ Natural: 25.80°C/W, Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 1.5W @ 50°C.
