Технічний опис 820-AG10D TE Connectivity / AMP
Description: CONN IC DIP SOCKET 20POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Solder, Housing Material: Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm).
Інші пропозиції 820-AG10D
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| 820-AG10D | TE Connectivity AMP Connectors |
 Description: CONN IC DIP SOCKET 20POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25.0µin (0.63µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) |
товару немає в наявності |
В кошику од. на суму грн. | |
 |
820-AG10D | AMP - TE CONNECTIVITY |
Description: AMP - TE CONNECTIVITY - 820-AG10D - IC- & Baustein-Sockel, 20 Kontakt(e), DIP-Sockel, 2.54 mm, DIPLOMATE 800, 7.62 mm Kontaktüberzug: Vergoldete Kontakte Steckverbindertyp: DIP-Sockel Rastermaß: 2.54 Anzahl der Kontakte: 20 Kontaktmaterial: Beryllium-Kupfer Reihenabstand: 7.62 Produktpalette: DIPLOMATE 800 SVHC: Lead (19-Jan-2021) |
товару немає в наявності |
В кошику од. на суму грн. |
| 820-AG10D |
|
Виробник: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
товару немає в наявності
В кошику
од. на суму грн.
| 820-AG10D |
|
Виробник: AMP - TE CONNECTIVITY
Description: AMP - TE CONNECTIVITY - 820-AG10D - IC- & Baustein-Sockel, 20 Kontakt(e), DIP-Sockel, 2.54 mm, DIPLOMATE 800, 7.62 mm
Kontaktüberzug: Vergoldete Kontakte
Steckverbindertyp: DIP-Sockel
Rastermaß: 2.54
Anzahl der Kontakte: 20
Kontaktmaterial: Beryllium-Kupfer
Reihenabstand: 7.62
Produktpalette: DIPLOMATE 800
SVHC: Lead (19-Jan-2021)
Description: AMP - TE CONNECTIVITY - 820-AG10D - IC- & Baustein-Sockel, 20 Kontakt(e), DIP-Sockel, 2.54 mm, DIPLOMATE 800, 7.62 mm
Kontaktüberzug: Vergoldete Kontakte
Steckverbindertyp: DIP-Sockel
Rastermaß: 2.54
Anzahl der Kontakte: 20
Kontaktmaterial: Beryllium-Kupfer
Reihenabstand: 7.62
Produktpalette: DIPLOMATE 800
SVHC: Lead (19-Jan-2021)
товару немає в наявності
В кошику
од. на суму грн.