8468-21A1-RK-TP 3M
Виробник: 3M
Description: CONN SOCKET PLCC 68POS TIN
Part Status: Active
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Finish - Post: Tin
Pitch - Post: 0.050" (1.27mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.050" (1.27mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 68 (4 x 17)
Operating Temperature: -40°C ~ 105°C
Type: PLCC
Mounting Type: Surface Mount
Features: Closed Frame
Packaging: Tube
| Кількість | Ціна |
|---|---|
| 2+ | 210.45 грн |
| 19+ | 183.93 грн |
| 38+ | 174.19 грн |
| 57+ | 159.67 грн |
| 114+ | 152.06 грн |
| 266+ | 133.06 грн |
| 513+ | 127.13 грн |
Відгуки про товар
Написати відгук
Технічний опис 8468-21A1-RK-TP 3M
Description: CONN SOCKET PLCC 68POS TIN, Part Status: Active, Contact Material - Post: Copper Alloy, Contact Finish Thickness - Post: 160.0µin (4.06µm), Contact Finish - Post: Tin, Pitch - Post: 0.050" (1.27mm), Contact Material - Mating: Copper Alloy, Contact Finish Thickness - Mating: 160.0µin (4.06µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.050" (1.27mm), Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 68 (4 x 17), Operating Temperature: -40°C ~ 105°C, Type: PLCC, Mounting Type: Surface Mount, Features: Closed Frame, Packaging: Tube.
Інші пропозиції 8468-21A1-RK-TP
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
|
8468-21A1-RK-TP | 3M Electronic Solutions Division |
IC & Component Sockets 68P PLCC SOCKET SMT W/LOCATION POSTS |
товару немає в наявності |
В кошику од. на суму грн. |
| 8468-21A1-RK-TP |
![]() |
Виробник: 3M Electronic Solutions Division
IC & Component Sockets 68P PLCC SOCKET SMT W/LOCATION POSTS
IC & Component Sockets 68P PLCC SOCKET SMT W/LOCATION POSTS
товару немає в наявності
В кошику
од. на суму грн.


