Результат пошуку "8731041" : > 60
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Мінімальне замовлення: 7
Мінімальне замовлення: 7
Мінімальне замовлення: 3
Мінімальне замовлення: 2
Мінімальне замовлення: 4
Мінімальне замовлення: 4
Мінімальне замовлення: 1000
Мінімальне замовлення: 2
Мінімальне замовлення: 3
Мінімальне замовлення: 4
Мінімальне замовлення: 2000
Мінімальне замовлення: 25
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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110-87-310-41-001101 | Preci-dip |
 IC & Component Sockets |
на замовлення 6822 шт: термін постачання 21-30 дні (днів) |
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110-87-310-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
на замовлення 10541 шт: термін постачання 21-31 дні (днів) |
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110-87-310-41-105101 | Preci-dip |
IC & Component Sockets 2.54mm, 10P, Surface mount, Gold Flash, 12.6x7.62x10.1x12.26 |
на замовлення 779 шт: термін постачання 21-30 дні (днів) |
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110-87-310-41-105191 | Preci-dip |
IC & Component Sockets |
на замовлення 405 шт: термін постачання 21-30 дні (днів) |
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114-87-310-41-117101 | Preci-Dip |
Conn DIP Socket SKT 10 POS 2.54mm Solder ST Thru-Hole Box |
на замовлення 4223 шт: термін постачання 21-31 дні (днів) |
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114-87-310-41-134161 | Preci-Dip |
Conn DIP Socket SKT 10 POS 2.54mm Solder ST SMD |
на замовлення 189 шт: термін постачання 21-31 дні (днів) |
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114-87-310-41-134191 | Preci-dip |
IC & Component Sockets |
на замовлення 507 шт: термін постачання 21-30 дні (днів) |
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114-87-310-41-134191 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Open Frame Packaging: Cut Tape (CT) Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
на замовлення 2944 шт: термін постачання 21-31 дні (днів) |
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114-87-310-41-134191 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Open Frame Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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116-87-310-41-011101 | Preci-dip |
IC & Component Sockets |
на замовлення 424 шт: термін постачання 21-30 дні (днів) |
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116-87-310-41-012101 | Preci-dip |
IC & Component Sockets |
на замовлення 550 шт: термін постачання 21-30 дні (днів) |
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116-87-310-41-012101 | Preci-Dip |
Conn IC Socket SKT 10 POS 2.54mm Solder ST Thru-Hole |
на замовлення 3024 шт: термін постачання 21-31 дні (днів) |
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614-87-310-41-001101 | Preci-dip |
IC & Component Sockets |
на замовлення 888 шт: термін постачання 21-30 дні (днів) |
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1814-100F | Techspray |
Description: DESOLDR BRAID NO-CLN 0.035" 100' Packaging: Bulk Color: White Length: 100' (30.5m) Type: No Clean Width: 0.035" (0.90mm) Product Type: Braid/Wick Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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LBM2016TR39J | Taiyo Yuden |
Description: FIXED IND 390NH 440MA 260MOHM SM Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: 0806 (2016 Metric) Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm) Mounting Type: Surface Mount Shielding: Unshielded Type: Drum Core, Wirewound Operating Temperature: -40°C ~ 105°C DC Resistance (DCR): 260mOhm Q @ Freq: 30 @ 25.2MHz Frequency - Self Resonant: 375MHz Material - Core: Ferrite Inductance Frequency - Test: 25.2 MHz Supplier Device Package: 0806 (2016 Metric) Height - Seated (Max): 0.071" (1.80mm) Part Status: Not For New Designs Inductance: 390 nH Current Rating (Amps): 440 mA |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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LBM2016TR39J | Taiyo Yuden |
Description: FIXED IND 390NH 440MA 260MOHM SM Packaging: Cut Tape (CT) Tolerance: ±5% Package / Case: 0806 (2016 Metric) Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm) Mounting Type: Surface Mount Shielding: Unshielded Type: Drum Core, Wirewound Operating Temperature: -40°C ~ 105°C DC Resistance (DCR): 260mOhm Q @ Freq: 30 @ 25.2MHz Frequency - Self Resonant: 375MHz Material - Core: Ferrite Inductance Frequency - Test: 25.2 MHz Supplier Device Package: 0806 (2016 Metric) Height - Seated (Max): 0.071" (1.80mm) Part Status: Not For New Designs Inductance: 390 nH Current Rating (Amps): 440 mA |
на замовлення 3900 шт: термін постачання 21-31 дні (днів) |
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110-87-310-41-001101 | Preci-Dip |
Conn DIP Socket SKT 10 POS 2.54mm Solder ST Thru-Hole Box |
товар відсутній |
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110-87-310-41-005101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товар відсутній |
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| 110-87-310-41-005101 | Preci-dip |
Headers & Wire Housings |
товар відсутній |
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110-87-310-41-105101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товар відсутній |
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110-87-310-41-105161 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товар відсутній |
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110-87-310-41-105161 | Preci-dip |
IC & Component Sockets |
товар відсутній |
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| 110-87-310-41-105191 | Preci-Dip |
DIL - SURFACE MOUNT PICK AND PLACE |
товар відсутній |
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| 110-87-310-41-105191 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товар відсутній |
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| 111-87-310-41-001101 | Preci-Dip |
Dual-In-Line Sockets |
товар відсутній |
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| 111-87-310-41-001101 | Preci-dip |
Headers & Wire Housings |
товар відсутній |
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114-87-310-41-117101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товар відсутній |
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| 114-87-310-41-117101 | Preci-dip |
IC & Component Sockets |
товар відсутній |
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| 114-87-310-41-117191 | Preci-Dip | Connector with open frame pck in T/R |
товар відсутній |
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| 114-87-310-41-134161 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товар відсутній |
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114-87-310-41-134161 | Preci-dip |
IC & Component Sockets |
товар відсутній |
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114-87-310-41-134191 | Preci-Dip |
DIL Socket, 2.54 mm, Surface Mount |
товар відсутній |
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115-87-310-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товар відсутній |
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115-87-310-41-001101 | Preci-dip |
IC & Component Sockets |
товар відсутній |
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115-87-310-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товар відсутній |
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115-87-310-41-003101 | Preci-Dip |
Conn DIP Socket SKT 10 POS 2.54mm Solder ST Thru-Hole Box |
товар відсутній |
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115-87-310-41-003101 | Preci-dip |
IC & Component Sockets |
товар відсутній |
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116-87-310-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товар відсутній |
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116-87-310-41-001101 | Preci-Dip |
Conn DIP Socket SKT 10 POS 1.54mm Solder ST Thru-Hole Box |
товар відсутній |
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| 116-87-310-41-001101 | Preci-dip |
IC & Component Sockets |
товар відсутній |
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116-87-310-41-002101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товар відсутній |
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116-87-310-41-002101 | Preci-Dip |
Conn DIP Socket SKT 10 POS 1.54mm Solder ST Thru-Hole Box |
товар відсутній |
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| 116-87-310-41-002101 | Preci-dip |
IC & Component Sockets |
товар відсутній |
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116-87-310-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товар відсутній |
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116-87-310-41-003101 | Preci-Dip |
Conn DIP Socket SKT 10 POS 1.54mm Solder ST Thru-Hole Box |
товар відсутній |
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| 116-87-310-41-003101 | Preci-dip |
IC & Component Sockets |
товар відсутній |
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116-87-310-41-004101 | Preci-Dip |
2.54 mm Solder tail Interconnect |
товар відсутній |
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116-87-310-41-004101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товар відсутній |
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| 116-87-310-41-004101 | Preci-dip |
IC & Component Sockets |
товар відсутній |
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116-87-310-41-006101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товар відсутній |
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| 116-87-310-41-006101 | Preci-Dip |
2.54 mm Solder tail Interconnect |
товар відсутній |
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| 116-87-310-41-006101 | Preci-dip |
IC & Component Sockets |
товар відсутній |
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| 116-87-310-41-007101 | Preci-Dip |
2.54 mm Solder tail Interconnect |
товар відсутній |
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116-87-310-41-007101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товар відсутній |
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| 116-87-310-41-007101 | Preci-dip |
IC & Component Sockets |
товар відсутній |
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116-87-310-41-008101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товар відсутній |
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116-87-310-41-008101 | Preci-Dip |
Conn DIP Socket SKT 10 POS 2.54mm Solder ST Thru-Hole Box |
товар відсутній |
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116-87-310-41-008101 | Preci-dip |
IC & Component Sockets |
товар відсутній |
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| 116-87-310-41-009101 | Preci-Dip |
CONNECTORS IC sockets |
товар відсутній |
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116-87-310-41-009101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товар відсутній |
| 110-87-310-41-001101 |
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Виробник: Preci-dip
IC & Component Sockets
IC & Component Sockets
на замовлення 6822 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 7+ | 50 грн |
| 10+ | 37.77 грн |
| 82+ | 30.84 грн |
| 533+ | 26.84 грн |
| 1025+ | 22.1 грн |
| 2501+ | 21.43 грн |
| 4428+ | 19.43 грн |
| 110-87-310-41-001101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
на замовлення 10541 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 7+ | 47.66 грн |
| 41+ | 34.38 грн |
| 123+ | 32.95 грн |
| 533+ | 26.88 грн |
| 1025+ | 22.18 грн |
| 5002+ | 19.49 грн |
| 10004+ | 17.85 грн |
| 110-87-310-41-105101 |
|
Виробник: Preci-dip
IC & Component Sockets 2.54mm, 10P, Surface mount, Gold Flash, 12.6x7.62x10.1x12.26
IC & Component Sockets 2.54mm, 10P, Surface mount, Gold Flash, 12.6x7.62x10.1x12.26
на замовлення 779 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 106.71 грн |
| 10+ | 92.13 грн |
| 82+ | 71.43 грн |
| 533+ | 59.62 грн |
| 1025+ | 50.34 грн |
| 2501+ | 47.67 грн |
| 3690+ | 43.93 грн |
| 110-87-310-41-105191 |
|
Виробник: Preci-dip
IC & Component Sockets
IC & Component Sockets
на замовлення 405 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 156.56 грн |
| 10+ | 135.12 грн |
| 100+ | 104.82 грн |
| 550+ | 87.46 грн |
| 1100+ | 74.77 грн |
| 2200+ | 69.43 грн |
| 4950+ | 66.43 грн |
| 114-87-310-41-117101 |
|
Виробник: Preci-Dip
Conn DIP Socket SKT 10 POS 2.54mm Solder ST Thru-Hole Box
Conn DIP Socket SKT 10 POS 2.54mm Solder ST Thru-Hole Box
на замовлення 4223 шт:
термін постачання 21-31 дні (днів)| 114-87-310-41-134161 |
|
Виробник: Preci-Dip
Conn DIP Socket SKT 10 POS 2.54mm Solder ST SMD
Conn DIP Socket SKT 10 POS 2.54mm Solder ST SMD
на замовлення 189 шт:
термін постачання 21-31 дні (днів)| 114-87-310-41-134191 |
|
Виробник: Preci-dip
IC & Component Sockets
IC & Component Sockets
на замовлення 507 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 98.92 грн |
| 10+ | 82.92 грн |
| 100+ | 64.56 грн |
| 500+ | 52.81 грн |
| 1000+ | 46.87 грн |
| 2000+ | 42.46 грн |
| 5000+ | 41.86 грн |
| 114-87-310-41-134191 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
на замовлення 2944 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 92.44 грн |
| 10+ | 75.25 грн |
| 100+ | 67.6 грн |
| 500+ | 51.9 грн |
| 114-87-310-41-134191 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1000+ | 51.05 грн |
| 2000+ | 46.09 грн |
| 116-87-310-41-011101 |
|
Виробник: Preci-dip
IC & Component Sockets
IC & Component Sockets
на замовлення 424 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 183.82 грн |
| 10+ | 158.16 грн |
| 84+ | 122.84 грн |
| 504+ | 86.12 грн |
| 1008+ | 80.11 грн |
| 1764+ | 75.44 грн |
| 116-87-310-41-012101 |
|
Виробник: Preci-dip
IC & Component Sockets
IC & Component Sockets
на замовлення 550 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 122.28 грн |
| 10+ | 105.18 грн |
| 84+ | 82.12 грн |
| 504+ | 68.1 грн |
| 1008+ | 54.81 грн |
| 2520+ | 52.54 грн |
| 3528+ | 50.27 грн |
| 116-87-310-41-012101 |
|
Виробник: Preci-Dip
Conn IC Socket SKT 10 POS 2.54mm Solder ST Thru-Hole
Conn IC Socket SKT 10 POS 2.54mm Solder ST Thru-Hole
на замовлення 3024 шт:
термін постачання 21-31 дні (днів)| 614-87-310-41-001101 |
|
Виробник: Preci-dip
IC & Component Sockets
IC & Component Sockets
на замовлення 888 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 95.8 грн |
| 10+ | 79.08 грн |
| 82+ | 62.09 грн |
| 533+ | 51.01 грн |
| 1025+ | 45.33 грн |
| 2501+ | 41.12 грн |
| 4428+ | 39.66 грн |
| 1814-100F |
|
Виробник: Techspray
Description: DESOLDR BRAID NO-CLN 0.035" 100'
Packaging: Bulk
Color: White
Length: 100' (30.5m)
Type: No Clean
Width: 0.035" (0.90mm)
Product Type: Braid/Wick
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: DESOLDR BRAID NO-CLN 0.035" 100'
Packaging: Bulk
Color: White
Length: 100' (30.5m)
Type: No Clean
Width: 0.035" (0.90mm)
Product Type: Braid/Wick
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5882.86 грн |
| LBM2016TR39J |
|
Виробник: Taiyo Yuden
Description: FIXED IND 390NH 440MA 260MOHM SM
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: 0806 (2016 Metric)
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Drum Core, Wirewound
Operating Temperature: -40°C ~ 105°C
DC Resistance (DCR): 260mOhm
Q @ Freq: 30 @ 25.2MHz
Frequency - Self Resonant: 375MHz
Material - Core: Ferrite
Inductance Frequency - Test: 25.2 MHz
Supplier Device Package: 0806 (2016 Metric)
Height - Seated (Max): 0.071" (1.80mm)
Part Status: Not For New Designs
Inductance: 390 nH
Current Rating (Amps): 440 mA
Description: FIXED IND 390NH 440MA 260MOHM SM
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: 0806 (2016 Metric)
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Drum Core, Wirewound
Operating Temperature: -40°C ~ 105°C
DC Resistance (DCR): 260mOhm
Q @ Freq: 30 @ 25.2MHz
Frequency - Self Resonant: 375MHz
Material - Core: Ferrite
Inductance Frequency - Test: 25.2 MHz
Supplier Device Package: 0806 (2016 Metric)
Height - Seated (Max): 0.071" (1.80mm)
Part Status: Not For New Designs
Inductance: 390 nH
Current Rating (Amps): 440 mA
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2000+ | 4.55 грн |
| LBM2016TR39J |
|
Виробник: Taiyo Yuden
Description: FIXED IND 390NH 440MA 260MOHM SM
Packaging: Cut Tape (CT)
Tolerance: ±5%
Package / Case: 0806 (2016 Metric)
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Drum Core, Wirewound
Operating Temperature: -40°C ~ 105°C
DC Resistance (DCR): 260mOhm
Q @ Freq: 30 @ 25.2MHz
Frequency - Self Resonant: 375MHz
Material - Core: Ferrite
Inductance Frequency - Test: 25.2 MHz
Supplier Device Package: 0806 (2016 Metric)
Height - Seated (Max): 0.071" (1.80mm)
Part Status: Not For New Designs
Inductance: 390 nH
Current Rating (Amps): 440 mA
Description: FIXED IND 390NH 440MA 260MOHM SM
Packaging: Cut Tape (CT)
Tolerance: ±5%
Package / Case: 0806 (2016 Metric)
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Drum Core, Wirewound
Operating Temperature: -40°C ~ 105°C
DC Resistance (DCR): 260mOhm
Q @ Freq: 30 @ 25.2MHz
Frequency - Self Resonant: 375MHz
Material - Core: Ferrite
Inductance Frequency - Test: 25.2 MHz
Supplier Device Package: 0806 (2016 Metric)
Height - Seated (Max): 0.071" (1.80mm)
Part Status: Not For New Designs
Inductance: 390 nH
Current Rating (Amps): 440 mA
на замовлення 3900 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 25+ | 11.55 грн |
| 32+ | 8.97 грн |
| 34+ | 8.29 грн |
| 50+ | 6.85 грн |
| 100+ | 6 грн |
| 250+ | 5.71 грн |
| 500+ | 5.28 грн |
| 1000+ | 4.04 грн |
| 110-87-310-41-001101 |
|
Виробник: Preci-Dip
Conn DIP Socket SKT 10 POS 2.54mm Solder ST Thru-Hole Box
Conn DIP Socket SKT 10 POS 2.54mm Solder ST Thru-Hole Box
товар відсутній
| 110-87-310-41-005101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
| 110-87-310-41-105101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товар відсутній
| 110-87-310-41-105161 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
| 110-87-310-41-105191 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товар відсутній
| 114-87-310-41-117101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товар відсутній
| 114-87-310-41-134161 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товар відсутній
| 115-87-310-41-001101 |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
| 115-87-310-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
| 115-87-310-41-003101 |
|
Виробник: Preci-Dip
Conn DIP Socket SKT 10 POS 2.54mm Solder ST Thru-Hole Box
Conn DIP Socket SKT 10 POS 2.54mm Solder ST Thru-Hole Box
товар відсутній
| 116-87-310-41-001101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
| 116-87-310-41-001101 |
|
Виробник: Preci-Dip
Conn DIP Socket SKT 10 POS 1.54mm Solder ST Thru-Hole Box
Conn DIP Socket SKT 10 POS 1.54mm Solder ST Thru-Hole Box
товар відсутній
| 116-87-310-41-002101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
| 116-87-310-41-002101 |
|
Виробник: Preci-Dip
Conn DIP Socket SKT 10 POS 1.54mm Solder ST Thru-Hole Box
Conn DIP Socket SKT 10 POS 1.54mm Solder ST Thru-Hole Box
товар відсутній
| 116-87-310-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
| 116-87-310-41-003101 |
|
Виробник: Preci-Dip
Conn DIP Socket SKT 10 POS 1.54mm Solder ST Thru-Hole Box
Conn DIP Socket SKT 10 POS 1.54mm Solder ST Thru-Hole Box
товар відсутній
| 116-87-310-41-004101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
| 116-87-310-41-006101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
| 116-87-310-41-007101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
| 116-87-310-41-008101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
| 116-87-310-41-008101 |
|
Виробник: Preci-Dip
Conn DIP Socket SKT 10 POS 2.54mm Solder ST Thru-Hole Box
Conn DIP Socket SKT 10 POS 2.54mm Solder ST Thru-Hole Box
товар відсутній
| 116-87-310-41-009101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
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