9-1437504-0 TE CONNECTIVITY / PARTNER STOCK
Виробник: TE CONNECTIVITY / PARTNER STOCK
Description: TE CONNECTIVITY / PARTNER STOCK - 9-1437504-0 - IC COMPONENT SOCKETS CONNECTORS
tariffCode: 85366990
productTraceability: No
rohsCompliant: YES
euEccn: NLR
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
SVHC: To Be Advised
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Технічний опис 9-1437504-0 TE CONNECTIVITY / PARTNER STOCK
Description: CONN TRANSIST TO-3 3POS TIN, Features: Closed Frame, Packaging: Bulk, Mounting Type: Chassis Mount, Type: Transistor, TO-3, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 3 (Oval), Termination: Solder, Housing Material: Polytetrafluoroethylene (PTFE), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper, Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper.
Інші пропозиції 9-1437504-0
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| 9-1437504-0 | TE Connectivity AMP Connectors |
Description: CONN TRANSIST TO-3 3POS TIN Features: Closed Frame Packaging: Bulk Mounting Type: Chassis Mount Type: Transistor, TO-3 Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 3 (Oval) Termination: Solder Housing Material: Polytetrafluoroethylene (PTFE) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
товару немає в наявності |
В кошику од. на суму грн. |
| 9-1437504-0 |
|
Виробник: TE Connectivity AMP Connectors
Description: CONN TRANSIST TO-3 3POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Chassis Mount
Type: Transistor, TO-3
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 3 (Oval)
Termination: Solder
Housing Material: Polytetrafluoroethylene (PTFE)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN TRANSIST TO-3 3POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Chassis Mount
Type: Transistor, TO-3
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 3 (Oval)
Termination: Solder
Housing Material: Polytetrafluoroethylene (PTFE)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику
од. на суму грн.