Технічний опис APF19-19-06CB CTS Electronic Components
Description: HEATSINK LOW-PROFILE FORGED, Material Finish: Black Anodized, Fin Height: 0.250" (6.35mm), Thermal Resistance @ Forced Air Flow: 7.10°C/W @ 200 LFM, Attachment Method: Thermal Tape, Adhesive (Not Included), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Width: 0.748" (19.00mm), Type: Top Mount, Shape: Square, Fins, Length: 0.748" (19.00mm), Material: Aluminum, Packaging: Box.
Інші пропозиції APF19-19-06CB
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
APF19-19-06CB | CTS Thermal Management Products |
 Description: HEATSINK LOW-PROFILE FORGEDMaterial Finish: Black Anodized Fin Height: 0.250" (6.35mm) Thermal Resistance @ Forced Air Flow: 7.10°C/W @ 200 LFM Attachment Method: Thermal Tape, Adhesive (Not Included) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 0.748" (19.00mm) Type: Top Mount Shape: Square, Fins Length: 0.748" (19.00mm) Material: Aluminum Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. |
| APF19-19-06CB |
|
Виробник: CTS Thermal Management Products
Description: HEATSINK LOW-PROFILE FORGED
Material Finish: Black Anodized
Fin Height: 0.250" (6.35mm)
Thermal Resistance @ Forced Air Flow: 7.10°C/W @ 200 LFM
Attachment Method: Thermal Tape, Adhesive (Not Included)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 0.748" (19.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 0.748" (19.00mm)
Material: Aluminum
Packaging: Box
Description: HEATSINK LOW-PROFILE FORGED
Material Finish: Black Anodized
Fin Height: 0.250" (6.35mm)
Thermal Resistance @ Forced Air Flow: 7.10°C/W @ 200 LFM
Attachment Method: Thermal Tape, Adhesive (Not Included)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 0.748" (19.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 0.748" (19.00mm)
Material: Aluminum
Packaging: Box
товару немає в наявності
В кошику
од. на суму грн.