Технічний опис AR22-HZL-TT Assmann WSW Components
Description: SOCKET, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.4" (10.16mm) Row Spacing, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 22 (2 x 11), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 196.9µin (5.00µm), Contact Material - Post: Beryllium Copper.
Інші пропозиції AR22-HZL-TT
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| AR 22-HZL-TT | Assmann WSW Components |
Description: SOCKET Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Beryllium Copper |
товару немає в наявності |
Мінімальне замовлення: 3360 шт В кошику од. на суму грн. |
| AR 22-HZL-TT |
Виробник: Assmann WSW Components
Description: SOCKET
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Beryllium Copper
Description: SOCKET
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
Мінімальне замовлення: 3360 шт
В кошику
од. на суму грн.