ATPL230AG55J19-R Microchip Technology
Виробник: Microchip Technology
Description: PL230A-AKU-R SAMG55J19A-MUT LQFP
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: Power Line Communications
Core Processor: External
Part Status: Active
DigiKey Programmable: Not Verified
Description: PL230A-AKU-R SAMG55J19A-MUT LQFP
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: Power Line Communications
Core Processor: External
Part Status: Active
DigiKey Programmable: Not Verified
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Технічний опис ATPL230AG55J19-R Microchip Technology
Description: PL230A-AKU-R SAMG55J19A-MUT LQFP, Packaging: Tape & Reel (TR), Mounting Type: Surface Mount, Interface: SPI, Operating Temperature: -40°C ~ 85°C, Voltage - Supply: 3V ~ 3.6V, Applications: Power Line Communications, Core Processor: External, Part Status: Active, DigiKey Programmable: Not Verified.
Інші пропозиції ATPL230AG55J19-R
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| ATPL230AG55J19-R | Виробник : Microchip Technology / Atmel | Network Controller & Processor ICs Bundle CPN for PRIME PLC modules/modems - Bundle PL230A-AKU-R plus SAMG55J19A-MUT |
товару немає в наявності |